RKD

Elite Etch series

The Elite Etch series by RKD Engineering comprises automated mixed acid decapsulators designed for precise and safe opening of various semiconductor packages.

Fully Automated

Process Control

≤ 20 μm

Etching Accuracy

Dual Acid System

HNO₃ + H₂SO₄ Compatibility

≤ 15 min
Typical Etching Time

Multi-Package Ready
Plastic, Ceramic, MEMS, QFN

Keyfeatures & benefits


Elite Etch Series delivers safe, automated chemical decapsulation optimized for semiconductor failure analysis.



Combining reliable process control, wire-safe etching, and versatile package compatibility, the Elite Etch Series delivers high-performance chemical decapsulation optimized for semiconductor failure analysis and reverse engineering.




01. Fast & Consistent Etching Performance
With automated acid delivery and precise high-temperature control, average decapsulation is completed in under 15 minutes. Ensures repeatable and reliable results for high-throughput environments.


02. Sensitive Component Protection

Engineered with ESD-safe operation and optimized acid flow dynamics to protect Cu/Au/Al bond wires and other delicate parts. Ideal for high-value chip analysis and failure diagnostics.


03. Versatile Package Compatibility
Supports full, local, and bevel etching modes with GUI-based control, adaptable to a wide range of packages including plastic, ceramic, and MEMS. Perfect for both R&D and production applications.

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