RKD
RA-9100
High-precision fiber laser decapsulation system engineered for safe, layer-by-layer mold compound removal.
RA-9100 minimizes chemical usage through localized targeting and real-time vision control, making it ideal for wirebond and flip-chip packages.
RKD
RA-9000
High-precision fiber laser decapsulation system engineered for safe, layer-by-layer mold compound removal.
RA-9000 minimizes chemical usage through localized targeting and real-time vision control, making it ideal for wirebond and flip-chip packages.
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1064 nm Wavelength | 20W Max Power | 1mJ/pulse Max Energy | 1.6kHz~4MHz Freq Range |
Key Features & Benefits
High-precision laser decapsulation system for accurate package layer removal.
Combining precision laser processing, advanced real-time imaging, and operator-controlled flexibility, the RA-9000 delivers optimized decapsulation performance across various package types. Compatible with applications such as plastic, ceramic, MEMS pre-opening and bond wire exposure, the RA-9000 reduces the need for chemical processing through its high-powered 1064nm fiber laser.
With focus and productivity improvements including automated laser AF and 22MP CCD camera monitoring, the RA-9000 offers a reliable solution for efficient, damage-free device preparation in semiconductor failure analysis and reverse engineering workflows.
1. Precision Localized, Layer-by-Layer Etching
The RA-9000 removes encapsulant materials—including mold compound and
glob top—layer by layer with pinpoint precision. It enables safe exposure of delicate components like
Al, Cu, and Au bond wires without any damage, making it ideal for high-accuracy failure analysis.
2. Versatile Pre-Decap and Cross-Sectioning
Supports the pre-opening of plastic, ceramic, and MEMS packages, along with cross-section preparation and
bonding cut. Designed to handle complex packaging with minimal reliance on harsh chemical processes,
ensuring flexibility for advanced applications.
3. Real-Time Visual Monitoring with Laser Autofocus
Equipped with a 22MP color CCD camera and autofocus laser control, the RA-9000 enables real-time process
visibility and precision control. It’s optimized for intricate cavity shaping and critical-area targeting in
both R&D and production settings.
 | 1064 nm Wavelength |
 | 20W Max Power |
 | 1mJ/pulse Max Energy |
 | 1.6kHz~4MHz Freq Range |
Keyfeatures & benefits
High-precision laser decapsulation system for accurate package layer removal.
Combining precision laser processing,
advanced real-time imaging, and operator-controlled flexibility, the RA-9100 delivers optimized decapsulation performance across various package types. Compatible with applications such as plastic, ceramic, MEMS pre-opening and bond wire exposure, the RA-9100 reduces the need for chemical processing through its high-powered 1064nm fiber laser.
With focus and productivity improvements including automated laser AF and 22MP CCD camera monitoring, the RA-9100 offers a reliable solution for efficient, damage-free device preparation in semiconductor failure analysis and reverse engineering workflows.
01. Precision Localized, Layer-by-Layer Etching
The RA-9100 removes encapsulant materials—including mold compound and glob top—layer by layer with pinpoint precision. It enables safe exposure of delicate components like Al, Cu, and Au bond wires without any damage, making it ideal for high-accuracy failure analysis.
02. Versatile Pre-Decap and Cross-Sectioning
Supports the pre-opening of plastic, ceramic, and MEMS packages, along with cross-section preparation and bonding cut. Designed to handle complex packaging with minimal reliance on harsh chemical processes, ensuring flexibility for advanced applications.
03. Real-Time Visual Monitoring with Laser Autofocus
Equipped with a 22MP color CCD camera and autofocus laser control, the RA-9100 enables real-time process visibility and precision control. It’s optimized for intricate cavity shaping and critical-area targeting in both R&D and production settings.
최적의 분석 솔루션과 공정 신뢰성을 위한 기술 포트폴리오를 소개합니다. Optotherm, Toho, RKD 등 글로벌 장비 브랜드가 제공하는 기능과 실제 산업 현장에서의 활용 사례를 확인해보세요.
Products최적의 분석 솔루션과 공정 신뢰성을 위한 기술 포트폴리오를 소개합니다. Optotherm, Toho, RKD 등 글로벌 장비 브랜드가 제공하는 기능과 실제 산업 현장에서의 활용 사례를 확인해보세요.
SEKOA는 기술력을 넘어 ESG 가치를 실현하는 데 앞장서고 있습니다. 책임 있는 기술 개발, 지역사회와의 협력, 그리고 지속 가능한 임팩트를 중심으로 더 나은 산업 생태계를 만들어갑니다.
Beyond TechnologySEKOA는 기술력을 넘어 ESG 가치를 실현하는 데 앞장서고 있습니다. 책임 있는 기술 개발, 지역사회와의 협력, 그리고 지속 가능한 임팩트를 중심으로 더 나은 산업 생태계를 만들어갑니다.
SEKOA와 함께 성장할 역량 있는 인재를 찾고 있습니다. 엔지니어링, 영업, 서비스 등 다양한 분야에서 커리어를 확장할 수 있는 기회를 제공합니다. 한국과 베트남에서 열려 있는 채용 기회를 확인해보세요.
Careers at SEKOASEKOA와 함께 성장할 역량 있는 인재를 찾고 있습니다. 엔지니어링, 영업, 서비스 등 다양한 분야에서 커리어를 확장할 수 있는 기회를 제공합니다. 한국과 베트남에서 열려 있는 채용 기회를 확인해보세요.
