High-Precision Decapsulation
& Failure Analysis Systems
RKD specializes in advanced decapsulation and failure analysis solutions for semiconductor packages.
Our systems are engineered for precision, reliability, and compatibility across a wide range of device types,
supporting high-yield analysis and sample integrity for modern semiconductor workflows.
RKD’s precision laser, mechanical, and chemical decapsulation systems
safely remove molding compound from semiconductor packages without damaging internal structures.
This enables accurate failure localization and root cause analysis for advanced ICs,
including flip-chip, wire bond, and complex multi-die packages.
Precision decapsulation for next-generation devices
If you're working with advanced ICs like flip-chip or multi-die packages, it's likely you've relied on RKD's laser, mechanical, or chemical decapsulation
tools to uncover internal structures safely and accurately.
As semiconductor packages become smaller and more complex, accurate decapsulation is critical to exposing internal structures without damaging surrounding layers. RKD’s tools enable precise, controlled removal across wire bond, flip-chip, and 3D stacked packages—ensuring success in analysis, FA, and process development.
RA-9000 Laser Decap Equipment Demonstration Video
For every package type,
purpose-built decapsulation systems.
From wire bond to flip-chip, and molded or bare-die devices, RKD provides the right decapsulation method—laser,
chemical, or mechanical—tailored to your package structure, material, and analysis needs.
An automated chemical etching system that removes encapsulant materials without thermal damage. Suitable for epoxy, molding compound, and glob top devices.
Chemical DecapAn automated chemical etching system that removes encapsulant materials without thermal damage. Suitable for epoxy, molding compound, and glob top devices.
A precision laser decapsulation system ideal for localized layer removal on advanced packages. It supports fine pitch wirebond and flip-chip structures with high accuracy.
LASER DecapA precision laser decapsulation system ideal for localized layer removal on advanced packages. It supports fine pitch wirebond and flip-chip structures with high accuracy.
A robust mechanical milling system that performs safe and efficient decap on large and hard packages. It enables rapid access to the die and bonding wires.
Mechanical DecapA robust mechanical milling system that performs safe and efficient decap on large and hard packages. It enables rapid access to the die and bonding wires.
The road to advanced decapsulation
Driving Innovation in Precision Decapsulation Technology
RKD has built years of expertise in precision decapsulation, offering optimized laser, chemical, and mechanical solutions for today's advanced semiconductor packages.
최적의 분석 솔루션과 공정 신뢰성을 위한 기술 포트폴리오를 소개합니다. Optotherm, Toho, RKD 등 글로벌 장비 브랜드가 제공하는 기능과 실제 산업 현장에서의 활용 사례를 확인해보세요.
Products최적의 분석 솔루션과 공정 신뢰성을 위한 기술 포트폴리오를 소개합니다. Optotherm, Toho, RKD 등 글로벌 장비 브랜드가 제공하는 기능과 실제 산업 현장에서의 활용 사례를 확인해보세요.
SEKOA는 기술력을 넘어 ESG 가치를 실현하는 데 앞장서고 있습니다. 책임 있는 기술 개발, 지역사회와의 협력, 그리고 지속 가능한 임팩트를 중심으로 더 나은 산업 생태계를 만들어갑니다.
Beyond TechnologySEKOA는 기술력을 넘어 ESG 가치를 실현하는 데 앞장서고 있습니다. 책임 있는 기술 개발, 지역사회와의 협력, 그리고 지속 가능한 임팩트를 중심으로 더 나은 산업 생태계를 만들어갑니다.
SEKOA와 함께 성장할 역량 있는 인재를 찾고 있습니다. 엔지니어링, 영업, 서비스 등 다양한 분야에서 커리어를 확장할 수 있는 기회를 제공합니다. 한국과 베트남에서 열려 있는 채용 기회를 확인해보세요.
Careers at SEKOASEKOA와 함께 성장할 역량 있는 인재를 찾고 있습니다. 엔지니어링, 영업, 서비스 등 다양한 분야에서 커리어를 확장할 수 있는 기회를 제공합니다. 한국과 베트남에서 열려 있는 채용 기회를 확인해보세요.
