RKD
UltraPrep IV
UltraPrep IV is a compact, high-precision system for backside thinning and
polishing with ±1 μm accuracy.
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±1 μm Thickness Accuracy | Fast Setup Video Alignment Included | 4-Point Alignment Eliminates Rotation Errors | < ±0.005 mm Thickness Variation | Small Footprint Bench-top Design |
Key Features & Benefits
The UltraPrep IV provides advanced mechanical thinning and polishing performance with precision,
repeatability, and ease-of-use—ideal for backside sample preparation in semiconductor failure analysis.
Combining precision control, fast setup, and ultra-low-stress processing, the UltraPrep IV enables efficient and safe backside sample preparation for advanced semiconductor failure analysis workflows.
1. High-Precision Thinning & Polishing
The UltraPrep IV offers ±1 μm depth accuracy, enabling highly
controlled thinning and polishing for sensitive samples.
Its automated system ensures consistent results,
making it ideal for reliable sample preparation in failure analysis.
2. Fast & Intuitive Operation
Built-in video alignment and 4-point die alignment simplify setup,
eliminating rotational errors and reducing operator dependency.
With a fully programmable user interface, even complex processes can be
executed efficiently and accurately.
3. Minimized Sample Damage
Removable sample holders and near-zero downforce operation
minimize mechanical stress on bond wires and sensitive structures.
This design ensures safe handling across a wide variety of package types,
from plastic to ceramic and more.
